PRESS RELEASE From ÅAC Microtec AB (f.m. Ångström Aerospace) 2008-10-17

Ã…AC presents proprietary robust XiVIA(R) through silicon via (TSV) technology for the global market

Ångström Aerospace will present its proprietary Through Silicon Via (TSV) technology, called XiVIA(R) to the global market during the SüSS Technology Roadshow for 3D Technology, MEMS and Advanced Packaging in Asia at the end of October 2008.

Download Ã…AC Microtec XiVIA(R) presentation file (8MB)

The XiVIA(R) is a robust through silicon via technology that have been space qualified and is implemented in several satellite subsystems that will be flown in space early 2009. In addition, the XiVIA(tm) is compatible with today's equipment! No need for additional investments in the MEMS fab.

The XiVIA(R) through silicon via (TSV) is a low-resistive (metallic) via compatible with substrates ranging from thinned 30 µm wafers to 800 µm wafer. The typical resistance of a 180 µm diameter via in a 300 µm substrate is less than 10 mOhm. XiVIA(tm) also offers crack mitigation design which reduces the wafer losses due to cracks.

Ã…AC Microtec XiVIA(R) technology enables interposers, stacked memories (MCP), POP, Wireless-SiP, WLP RP-SiP, 3D-System-on-Chip (3D-SoC).

"The release of our XIVIA(R) technology marks a big step for Ångström Aerospace and clearly show that we are executing our plan of growing a product company", says Kjell Lindqvist, Chief Operating Officer of ÅAC Microtec.


FOR MORE INFORMATION

• Fredrik Bruhn, CEO Ã…AC Microtec, Tel +46 18-560130, +46 707-833215, e-mail This e-mail address is being protected from spambots. You need JavaScript enabled to view it , www.aacmicrotec.com

FACTS

• Ã…AC Microtec offer products and services for robust embedded systems based on world leading packaging technology. Ã…AC was founded in 2005 as an academic spin-off from the Ã…ngström Laboratory at Uppsala University..