ÅAC offers rapid design, prototyping, and production ranging from small scale to large volume of silicon interposers. The interposers features ÅAC proprietary through silicon via (TSV) technology, XiVIA®, which is compatible with today's MEMS foundry equipment.

Contact us today to get a quoute for a silicon interposer of your needs.

Download a detailed presentation on ÅAC XiVIA® through silicon via technology (PDF, 8 MB)

Interposers are excellent for handling fine pitch bare die, like FPGAs on low cost substrates like LTCC, HTCC, PCB, etc. The interposer translates the fine soldering pad pitch to a standard footprint, such as a 500 µm pitch, or 1.27 mm pitch BGA or CGA footprint.

Let's illustrate the use of an interposer with ÅAC XiVIA® through silicon via marked as orange. A complex module with several bare die or other components need to be mounted to a standard footprint. An interposer can be used as illustrated below to adapt the complex substrate to the standard footprint by re-routing on the interposer. This also very affectively allow future upgrades since the top substrate can be changed easily, it can be upgraded with newer IC circutry, CMOS cameras, etc. and still be compatible with the orginial footprint. The interposer can be selected between 100 µm to 800 µm in thickness.

The following pictures shows and interposer design and manufactured by Ã…AC Microtec for a high power H-bridge module for magnetic attitude control of spacecraft. The interposer translates a three (3) H-bridge substrate to a standard 525 pad BGA interface.

Contact us today to get a quoute for a silicon interposer of your needs