ÅAC XiVIA® is compatible with today's MEMS foundry equipment and easy to implement. If you need a low resistive, robust, and cost efficient through silicon via, contact us today for a license discussion.

ÅAC XiVIA® through silicon via (TSV) Summary:

• Support robust silicon interposer (via-first)
• Metallic < 10 mΩ
• Via metalization and redistribution layer at the same time
• Stable process with today's equipment
• Process licensed to Silex Microsystems
• Short plating time on plugged vias
• Fatigue pull test for 17000 cycles at 4 Mpa - passed
• Pull strength > 20 MPa - passed
• Shear strength > 30 MPa - passed
• Thermal shock to -160°C - passed
• Thermal cycling, -40°C to +125°C for 500 cycles - passed
• Down to 100 µm pitch

Download a detailed presentation on ÅAC XiVIA® through silicon via technology (PDF, 8 MB)

XiVIA® is excellent for robust silicon interposers.